#1113ENG JPCA SHOW 2011 (Part I)
#1113ENG JPCA SHOW 2011 (Part I)
DKN Research Newsletter
#1113, June 12, 2011 (English Edition)
Electronic Packaging Industry News from Japan & Asia
JPCA SHOW 2011 (Part I)
The largest exhibition for the Printed Circuit Board industry and Packaging Technologies was held on June 1, 2011 at the Tokyo Big Sight in Japan for three days. The devastating earthquake and tsunami disaster in Eastern Japan was still fresh on everyone’s minds and our thoughts and prayers continue to go out to all those in need.
Reports that business was crippled for circuit board manufacturers and material suppliers were overstated. More than 500 companies and organizations participated in this years show, making the exhibition size slightly larger than last year. The number of registered visitors was nearly identical to last year as thirty thousand guests attended the three day exhibition. The number of registered foreign visitors declined by 25% this year; however, about fifteen hundred engineers from other countries did attend. The reason for the decline in foreign visitors is probably due to their concern about the risks of radioactive contamination caused by the TEPCO nuclear reactor accidents.
Open seminar programs at the convention featured discussions about new technologies and business ventures. Institutional researchers introduced innovative new technologies, while market researchers explained the latest business trends from smart phones and tablet PCs, and how consumer demands for these products are driving printed circuit board sales. Sales engineers from large companies promoted their new products while explaining the advantages from these next generation technologies; and manufacturing staff from circuit board plants presented their problem solving skills and yield improvement processes. More than one hundred college students participated in a poster session where they had the opportunity to present their R&D activities. Translators were available for the larger, main event sessions. They were able to provide instant translations to the audience when foreign speakers were presenting. The special events programs were very popular and attracted large audiences.
One of the most popular booths featured tear down analysis of the best selling consumer electronic products that included smart phones, tablet PCs and 3D flat panel TVs. Actual working products from brand name manufactures were taken apart and displayed in showcase windows. The “show and tell” provided analysis of the latest technology used in circuit boards, semiconductor packaging, displays and more from these popular electronics products. It provided a wealth of information. Many wanted to snap a few photos of the tear down samples, but photos and videos were not allowed. However, you were allowed to write detailed notes. Unfortunately, a picture is worth a thousand words.
That’s it for now…..stay tuned for part 2 in the next newsletter from DKN Research.
Dominique K. Numakura
DKN Research, www.dknresearch.com
Headlines of the week
(Please contact haverhill@dknreseach.com for further information of the news.)
1.Panasonic Electric (PWB material supplier in Japan) 5/25
Has developed a new halogen-free laminate series “MEGATRON2” with a low tangent loss of 0.010 for high speed multi-layer circuit boards.
2.Panasonic Electric (PWB material supplier in Japan) 5/26
Has commercialized a new halogen-free laminate series “MEGATRON GX (R-1515E)” with excellent flatness for CSP or PoP substrates of mobile products.
3.Ube Industries (Major chemical company in Japan) 5/27
Has agreed to make a new JV with Samsung Mobile Display Co. for the production of the polyimide materials assuming the applications of the display devices.
4.TDK (Major component supplier in Japan) 5/31
Has developed the industry first transparent organic EL display with high resolution for mobile devices, and started the volume production.
5.Rohm (Major component supplier in Japan) 5/30
Has developed three kinds of new driver IC devices for double touch type touch screen switches of the portable electronics.
6.Elpida Memory (Major semiconductor manufacturer in Japan) 5/30
Has agreed for the new R&D project of TSV package technologies including 28 nano meter process with Power Technology and UMC in Taiwan.
7.Fuji Film (Major film material manufacturer in Japan) 6/8
Will invest 16 billion yens to install a new manufacturing line of the wide web “Fuji Tach”, VA film of the flat LCD TV.
8.Nippon Seiki (Major module manufacturer in Japan) 6/9
Has developed new mono color organic EL display series with 50% lower energy consumption compared with white color products.
9.Mitsui Metal (Major copper foil supplier in Japan) 6/12
Will build a new manufacturing line of the ultra thin copper foil in Malaysia with a monthly capacity of 600 thousand sq meters. The operation will start in April 2012.
10. Nikkan Industries (PWB material supplier in Japan) 6/12
Has co-developed a new flexible RF absorption material with Komatsu Seiren.
June 12, 2011