3D Etching Process of the Hybrid Laminate of Metal Foils on Polyimide Film to Build Ultra Thin Connectors for High Density Flexible Circuits
UTF Connection Systems provide extremely low height connections smaller than 0.3 mm on the rigid board surface for high density flexible circuits using micro bump arrays.
The connector devices have been developed utilizing the lamination and etching capabilities of Hirai Seimitsu.
Click here to download the copy of thePCMI 2011 rev.2.pdf
Tuesday, October 11, 2011
